Abstract

A time domain approach to investigate and predict impedances and scattering parameters of a DC power bus is proposed. This approach is based on a cavity model and is achieved using a circuit simulation tool - SPICE. A SPICE-based circuit model for triangular power plane segments is described, verified and applied to simulate both the frequency and time domain characteristics of an irregularly shaped two-layer PCB board. Furthermore, the current draw from a surface mount technology (SMT) decoupling capacitor is simulated and estimated using this approach. Near-field electromagnetic loop probes are used to validate the current estimation qualitatively. Additionally the frequency banchwidth of this SPICE model is investigated using network analyzer and time domain reflectometry.

Meeting Name

IEEE International Symposium on Electromagnetic Compatibility (2004: Aug. 9-13, Santa Clara, CA)

Department(s)

Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory

Keywords and Phrases

DC Power Bus; S-Parameters; SMT Decoupling Capacitors; SPICE; Capacitors; Cavity Model; Circuit Noise; Circuit Simulation; Circuit Simulation Tool; Current Draw Estimation; Current Estimation; Electric Current; Electric Impedance; Electromagnetic Coupling; Frequency Bandwidth; Frequency Domain Characteristics; Impedances; Irregularly Shaped Two-Layer PCB Board; Near-Field Electromagnetic Loop Probes; Network Analyzer; Noise; Parameter Estimation; Printed Circuits; Scattering Parameters; Surface Mount Technology; Time Domain Reflectometry; Triangular Power Plane Segments; Arbitrarily Shaped Power Planes; Current Draw; Equivalent Circuits; Near-Field Electromagnetic Loop Probe; TDR; VNA

International Standard Book Number (ISBN)

780384431

International Standard Serial Number (ISSN)

1077-4076

Document Type

Article - Conference proceedings

Document Version

Final Version

File Type

text

Language(s)

English

Rights

© 2004 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

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