An accurate analytical model to predict via coupling within rectangular power-return plane structures is developed. Loss mechanisms, including radiation loss, dielectric loss, and conductor loss, are considered. The radiation loss is incorporated into a complex propagating wavenumber as an artificial loss mechanism. The quality factors associated with the three loss mechanisms are calculated and compared. The effects of radiation loss on input impedances and reflection coefficients are investigated for both high-dielectric-loss and low-dielectric-loss PCBs. Measurements are performed to validate the effectiveness of the model.
J. Chen et al., "Via Coupling Within Power-Return Plane Structures Considering the Radiation Loss," Proceedings of the IEEE International Symposium on Electromagnetic Compatibility, 2004, Institute of Electrical and Electronics Engineers (IEEE), Jan 2004.
The definitive version is available at http://dx.doi.org/10.1109/ISEMC.2004.1349821
IEEE International Symposium on Electromagnetic Compatibility, 2004
Electrical and Computer Engineering
Keywords and Phrases
EMC; EMI; PCB Designs; Q-Factor; Conductor Loss; Dielectric Loss; Dielectric Losses; Electric Impedance; Electromagnetic Compatibility; Electromagnetic Coupling; Electromagnetic Interference; Input Impedance; Network Analysis; Power-Return Plane Structures; Printed Circuit Layout; Printed Circuits; Propagating Wavenumber; Quality Factors; Radiation Loss; Reflection Coefficient; Via Coupling
Article - Conference proceedings
© 2004 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.