Abstract

Increases in the speed and density of electronic systems do not necessarily result in tougher electromagnetic compatibility problems. In fact, recent advances in packaging technology can help designers to meet electromagnetic compatibility requirements. However, working with new technologies requires us to re-evaluate existing EMC design models and guidelines. Understanding the system-level impact of component-level packaging changes, is a prerequisite for meeting stringent electromagnetic compatibility requirements in a timely and cost-effective manner.

Meeting Name

IEEE 3rd Topical Meeting on Electrical Performance of Electronic Packaging, 1994

Department(s)

Electrical and Computer Engineering

Keywords and Phrases

EMC Design Models; Component Packaging; Electromagnetic Compatibility; Electronic Systems; Packaging

Document Type

Article - Conference proceedings

Document Version

Final Version

File Type

text

Language(s)

English

Rights

© 1994 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

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