A non-orthogonal time-domain full-wave solver, is developed based on the discrete surface integral (DSI) technique. Closed form expressions are derived for the coefficients used in the leap-frog computation scheme so that the DSI technique can be implemented as a generalised finite-difference procedure. This procedure is employed to investigate the propagation characteristics of a typical interconnect via in printed circuits. The numerically calculated scattering parameters show consistent behavior with measured results. A square via with equal area is also evaluated.
H. Shi and J. L. Drewniak, "Study of Interconnect Vias by the Discrete Surface Integral Method," Proceedings of the 1995 IEEE International Symposium on Electromagnetic Compatibility, 1995, Institute of Electrical and Electronics Engineers (IEEE), Jan 1995.
The definitive version is available at http://dx.doi.org/10.1109/ISEMC.1995.523552
1995 IEEE International Symposium on Electromagnetic Compatibility, 1995
Electrical and Computer Engineering
Keywords and Phrases
S-Parameters; Closed Form Expressions; Coefficients; Discrete Surface Integral; Discrete Surface Integral Method; Finite Difference Time-Domain Analysis; Finite-Difference Procedure; Integral Equations; Interconnect Vias; Measured Results; Nonorthogonal Time-Domain Full-Wave Solver; Printed Circuits; Propagation Characteristics; Scattering Parameters; Square Via
Article - Conference proceedings
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