Abstract
Guidelines for the selection and placement of decoupling capacitors that work well for one-sided or two-sided printed circuit boards are not appropriate for multilayer boards with power and ground planes. Boards without internal planes take advantage of the power bus inductance to help decouple components at the higher frequencies. An effective decoupling strategy for multilayer boards must account for the low inductance and relatively high capacitance of the power bus.
Recommended Citation
T. H. Hubing et al., "Power Bus Decoupling on Multilayer Printed Circuit Boards," IEEE Transactions on Electromagnetic Compatibility, vol. 37, no. 2, pp. 155 - 166, Institute of Electrical and Electronics Engineers (IEEE), May 1995.
The definitive version is available at https://doi.org/10.1109/15.385878
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
Capacitance; Capacitors; Decoupling Capacitors; Decoupling Strategy; Ground Planes; Inductance; Multilayer Printed Circuit Boards; Power Bus Decoupling; Power Bus Inductance; Power Planes; Power Supply Circuits; Printed Circuit Design; Surges; Transients; Nonhomogeneous Media; Printed Circuits; Voltage; Capacitors; Power Distribution; Integrated Circuit Noise; Power System Modeling; Frequency; Current Supplies
International Standard Serial Number (ISSN)
0018-9375; 1558-187X
Document Type
Article - Journal
Document Version
Final Version
File Type
text
Language(s)
English
Rights
© 1995 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 May 1995
