Due to the increase in board density, routing traces on different layers becomes a widely used strategy. Through-hole vias are often used to connect these traces. Those vias that penetrate power/ground plane pairs could cause noise coupling between signal and power/ground nets. At the same time, the need for clean signal transmitted to receivers results in a wide use of differential signals. This paper studies the noise coupling mechanism caused by a differential pair of vias penetrating power/ground plane pair using a physics-based via-plane model combined with transmission line models for traces. A 26-layer printed circuit board with a pair of differential vias have been modeled. The simulated results clearly demonstrate the impact of ground vias and via stubs on noise coupling.
M. Cocchini et al., "Noise Coupling Between Power/Ground Nets Due to Differential Vias Transitions in a Multilayer PCB," Proceedings of the IEEE International Symposium on Electromagnetic Compatibility, 2008, Institute of Electrical and Electronics Engineers (IEEE), Aug 2008.
The definitive version is available at http://dx.doi.org/10.1109/ISEMC.2008.4652163
IEEE International Symposium on Electromagnetic Compatibility, 2008
Electrical and Computer Engineering
Keywords and Phrases
Cavity Model; Differential Signal; Ground Vias; Noise Coupling Between Signal and Power/Ground Nets; Signal Via Transition; Via Capacitance; Via Stub
Library of Congress Subject Headings
Article - Conference proceedings
© 2008 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.