Due to the increase in board density, routing traces on different layers becomes a widely used strategy. Through-hole vias are often used to connect these traces. Those vias that penetrate power/ground plane pairs could cause noise coupling between signal and power/ground nets. At the same time, the need for clean signal transmitted to receivers results in a wide use of differential signals. This paper studies the noise coupling mechanism caused by a differential pair of vias penetrating power/ground plane pair using a physics-based via-plane model combined with transmission line models for traces. A 26-layer printed circuit board with a pair of differential vias have been modeled. The simulated results clearly demonstrate the impact of ground vias and via stubs on noise coupling.
M. Cocchini et al., "Noise Coupling Between Power/Ground Nets Due to Differential Vias Transitions in a Multilayer PCB," Proceedings of the IEEE International Symposium on Electromagnetic Compatibility (2008, Detroit, MI), Institute of Electrical and Electronics Engineers (IEEE), Aug 2008.
The definitive version is available at https://doi.org/10.1109/ISEMC.2008.4652163
IEEE International Symposium on Electromagnetic Compatibility (2008: Aug. 18-22, Detroit, MI)
Electrical and Computer Engineering
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Cavity Model; Differential Signal; Ground Vias; Noise Coupling Between Signal and Power/Ground Nets; Signal Via Transition; Via Capacitance; Analysis; Noise; Integrated Circuit Modeling; Couplings; Geometry; Microstrip; Impedance; Stripline; Transmission Lines; Electromagnetic Coupling; Network Routing; Printed Circuits; Printed Circuit Board; Noise Coupling; Ground Nets; Power Nets; Differential Vias Transition; Multilayer PCB; Routing Trace; Transmission Line Model; Physics-Based Via-Plane Model
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Article - Conference proceedings
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