Abstract

This paper introduces a finite-difference time-domain (FDTD) approach to modeling portions of ball grid array (BGA) package interconnect circuits. A full wave circuit model including vias, trace segments, and ground vias was generated, using a computer gridding tool, and fed into the FDTD (Taflove and Hagness, 2005) program. The simulated results were correlated with TDR measurements

Department(s)

Electrical and Computer Engineering

Keywords and Phrases

Ball Grid Arrays; Finite Difference Time Domain Analysis; Integrated Circuit Interconnections; Integrated Circuit Modelling

Document Type

Article - Conference proceedings

Document Version

Final Version

File Type

text

Language(s)

English

Rights

© 2006 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

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