This paper introduces a Finite-Difference Time-Domain (FDTD) approach to modeling portions of Ball Grid Array (BGA) package interconnect circuits. A fullwave circuit model including vias, trace segments, and ground vias was generated, using a computer gridding tool, and fed into the FDTD (Taflove and Hagness, 2005) program. The simulated results were correlated with TDR measurements.
X. Chen et al., "Large Scale Signal and Interconnect FDTD Modeling for BGA Package," Proceedings of the IEEE 15th Topical Meeting on Electrical Performance of Electronic Packaging (2006, Scottsdale, AZ), pp. 299-302, Institute of Electrical and Electronics Engineers (IEEE), Oct 2006.
The definitive version is available at https://doi.org/10.1109/EPEP.2006.321160
IEEE 15th Topical Meeting Electrical Performance of Electronic Packaging (2006: Oct. 23-25, Scottsdale, AZ)
Electrical and Computer Engineering
Keywords and Phrases
Ball Grid Arrays; Finite Difference Time Domain Analysis; Integrated Circuit Interconnections; Integrated Circuit Modelling; Electric Currents; Electronics Packaging; Networks (Circuits); Nonlinear Optics; (p,p,t) Measurements; Ball Grid Array (BGA) Packages; Circuit Modeling; Electrical Performances; Electronic Packaging; FDTD Modeling; Finite Difference Time Domain (FDTD-3D); Gridding; Interconnect Circuits; Large Scales; Simulated Results; Finite Difference Time Domain Method
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Article - Conference proceedings
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