This paper introduces a finite-difference time-domain (FDTD) approach to modeling portions of ball grid array (BGA) package interconnect circuits. A full wave circuit model including vias, trace segments, and ground vias was generated, using a computer gridding tool, and fed into the FDTD (Taflove and Hagness, 2005) program. The simulated results were correlated with TDR measurements
X. Chen et al., "Large Scale Signal and Interconnect FDTD Modeling for BGA Package," Electrical Performance of Electronic Packaging, Institute of Electrical and Electronics Engineers (IEEE), Oct 2006.
The definitive version is available at http://dx.doi.org/10.1109/EPEP.2006.321160
Electrical and Computer Engineering
Keywords and Phrases
Ball Grid Arrays; Finite Difference Time Domain Analysis; Integrated Circuit Interconnections; Integrated Circuit Modelling
Article - Conference proceedings
© 2006 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.