Microwave nondestructive evaluation (NDE) techniques have shown great potential for disbond detection in multi-layer dielectric structures. However, a quantitative disbond thickness estimation scheme has not been introduced yet. In this paper, we propose a maximum-likelihood (ML) disbond thickness estimation scheme utilizing multiple independent measurements obtained at different frequencies. By simulations and experiments, we show that the proposed scheme produces highly accurate disbond thickness estimates.
M. A. Abou-Khousa and R. Zoughi, "High Accuracy Disbond Thickness Estimation Scheme Employing Multiple-Frequency Near-Field Microwave Measurements," Proceedings of the IEEE Instrumentation and Measurement Technology Conference (2006, Sorrento, Italy), pp. 1967-1970, Institute of Electrical and Electronics Engineers (IEEE), Apr 2006.
The definitive version is available at http://dx.doi.org/10.1109/IMTC.2006.328387
IEEE Instrumentation and Measurement Technology Conference (2006: Apr. 24-27, Sorrento, Italy)
Electrical and Computer Engineering
Air Force Research Laboratory (Wright-Patterson Air Force Base, Ohio)
Keywords and Phrases
Disbond Thickness Estimation; Multiple Frequency Measurements; Computer Simulation; Maximum Likelihood; Measurement Theory; Microwave Frequencies; Parameter Estimation; Disbond Thickness; Maximum Likelihood (ML); Nondestructive Evaluation (NDE)
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International Standard Serial Number (ISSN)
Article - Conference proceedings
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