Abstract

Microwave nondestructive evaluation (NDE) techniques have shown great potential for disbond detection in multi-layer dielectric structures. However, a quantitative disbond thickness estimation scheme has not been introduced yet. In this paper, we propose a maximum-likelihood (ML) disbond thickness estimation scheme utilizing multiple independent measurements obtained at different frequencies. By simulations and experiments, we show that the proposed scheme produces highly accurate disbond thickness estimates.

Meeting Name

IEEE Instrumentation and Measurement Technology Conference (2006: Apr. 24-27, Sorrento, Italy)

Department(s)

Electrical and Computer Engineering

Sponsor(s)

Air Force Research Laboratory (Wright-Patterson Air Force Base, Ohio)

Keywords and Phrases

Disbond Thickness Estimation; Multiple Frequency Measurements; Computer Simulation; Maximum Likelihood; Measurement Theory; Microwave Frequencies; Parameter Estimation; Disbond Thickness; Maximum Likelihood (ML); Nondestructive Evaluation (NDE)

International Standard Book Number (ISBN)

0780393600; 9780780393608

International Standard Serial Number (ISSN)

1091-5281

Document Type

Article - Conference proceedings

Document Version

Final Version

File Type

text

Language(s)

English

Rights

© 2006 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

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