Abstract

Microwave nondestructive evaluation (NDE) techniques have shown great potential for disbond detection in multi-layer dielectric structures. However, a quantitative disbond thickness estimation scheme has not been introduced yet. In this paper, we propose a maximum-likelihood (ML) disbond thickness estimation scheme utilizing multiple independent measurements obtained at different frequencies. By simulations and experiments, we show that the proposed scheme produces highly accurate disbond thickness estimates

Meeting Name

IEEE Instrumentation and Measurement Technology Conference, 2006

Department(s)

Electrical and Computer Engineering

Sponsor(s)

Air Force Research Laboratory (Wright-Patterson Air Force Base, Ohio)

Keywords and Phrases

Maximum Likelihood Estimation; Microwave Measurement; Nondestructive Testing

Document Type

Article - Conference proceedings

Document Version

Final Version

File Type

text

Language(s)

English

Rights

© 2006 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

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