Abstract
Microwave nondestructive evaluation (NDE) techniques have shown great potential for disbond detection in multi-layer dielectric structures. However, a quantitative disbond thickness estimation scheme has not been introduced yet. In this paper, we propose a maximum-likelihood (ML) disbond thickness estimation scheme utilizing multiple independent measurements obtained at different frequencies. By simulations and experiments, we show that the proposed scheme produces highly accurate disbond thickness estimates.
Recommended Citation
M. A. Abou-Khousa and R. Zoughi, "High Accuracy Disbond Thickness Estimation Scheme Employing Multiple-Frequency Near-Field Microwave Measurements," Proceedings of the IEEE Instrumentation and Measurement Technology Conference (2006, Sorrento, Italy), pp. 1967 - 1970, Institute of Electrical and Electronics Engineers (IEEE), Apr 2006.
The definitive version is available at https://doi.org/10.1109/IMTC.2006.328387
Meeting Name
IEEE Instrumentation and Measurement Technology Conference (2006: Apr. 24-27, Sorrento, Italy)
Department(s)
Electrical and Computer Engineering
Sponsor(s)
Air Force Research Laboratory (Wright-Patterson Air Force Base, Ohio)
Keywords and Phrases
Disbond Thickness Estimation; Multiple Frequency Measurements; Computer Simulation; Maximum Likelihood; Measurement Theory; Microwave Frequencies; Parameter Estimation; Disbond Thickness; Maximum Likelihood (ML); Nondestructive Evaluation (NDE)
International Standard Book Number (ISBN)
978-0780393608
International Standard Serial Number (ISSN)
1091-5281
Document Type
Article - Conference proceedings
Document Version
Final Version
File Type
text
Language(s)
English
Rights
© 2006 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Apr 2006
