Abstract

Currents associated with high-speed digital devices have significant impacts on EMI problems in VLSI design and operation. In this paper, a simple transmission line model was implemented as an initial step to represent the EMI mechanisms associated with an IC package. Numerical modeling results were compared with near field scanning measurements and show that the magnetic field deduced from the measurements agrees well with the numerical predictions.

Meeting Name

IEEE International Symposium on Electromagnetic Compatibility (2002: Aug. 19-23, Minneapolis, MN)

Department(s)

Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory

Keywords and Phrases

EMI Mechanisms; EMI Problems; IC Package; VLSI; VLSI Design; VLSI Operation; Electromagnetic Compatibility; Electromagnetic Interference; High-Speed Digital Devices; Integrated Circuit Modelling; Integrated Circuit Packaging; Integrated Circuit Testing; Magnetic Field; Magnetic Fields; Microstrip Lines; Microstrip Structure; Near Field Scanning Measurements; Numerical Modeling; Transmission Line Model; Transmission Line Theory; Microstrip; Near Field Scanning

International Standard Book Number (ISBN)

780372646

International Standard Serial Number (ISSN)

0190-1494

Document Type

Article - Conference proceedings

Document Version

Final Version

File Type

text

Language(s)

English

Rights

© 2002 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

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