Doctoral Dissertations

Keywords and Phrases

Electrostatic Discharge; SEED; Soft Failure

Abstract

"This research proposal presents a methodology whereby an integrated circuit (IC) can be characterized with respect to soft-failures induced by Electrostatic Discharge (ESD)-like events. This methodology uses an exclusively "black-box" approach to determine the response of an IC in a system-level environment, thereby allowing it to be implemented without intimate knowledge of the DUT IC. Results from this methodology can be referenced during system design to raise awareness of specific vulnerabilities of the core system ICs.

During work on this methodology, several sub topics have been explored and developed in the field of system-level ESD. Sections 2 and 3 introduce two topics which were developed to facilitate the generation and expression of IC pin models. Papers 1 and 2 introduce injection methods for characterizing complete systems on an interface-by-interface basis and form the foundation for the following works. Papers 2 and 3 mirror Papers 1 and 2 but instead shift focus away from the system as a whole and outline methods for characterizing the integrated circuits directly. Finally, Section 4 outlines a model method which can be used to describe the failures found in Paper 4 in circuit simulation, rounding out the work. Additional measurements which were unable to be included in Paper 4 are included in Appendices A, B, and C"--Abstract, page iv.

Advisor(s)

Pommerenke, David

Committee Member(s)

Beetner, Daryl G.
Fan, Jun, 1971-
Khilkevich, Victor
Gossner, Harald

Department(s)

Electrical and Computer Engineering

Degree Name

Ph. D. in Electrical Engineering

Publisher

Missouri University of Science and Technology

Publication Date

Fall 2016

Journal article titles appearing in thesis/dissertation

  • Powered system-level conductive TLP probing method for ESD/EMI hard fail and soft fail threshold evaluation
  • A systematic method for determining soft-failure robustness of a subsystem
  • A passive coupling circuit for injecting TLP-like stress into only one end of a driver/receiver system
  • Characterization of an application processor with respect to ESD-induced soft failures

Pagination

xvii, 210 pages

Note about bibliography

Includes bibliographic references.

Rights

© Benjamin J. Orr

Document Type

Dissertation - Open Access

File Type

text

Language

English

Library of Congress Subject Headings

Integrated circuits -- Protection
Electric discharges
Electrostatics
Electronic circuits -- Noise -- Detection
Electromagnetic compatibility

Thesis Number

T 11046

Electronic OCLC #

974710282

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