"Modeling and simulating the multi-scale nature of a power distribution network (PDN) is essential to ensure the correct functioning of the devices connected to it. Simple parallel-plate sections constitute the core of these PDN geometries, together with sections where a large number of holes and vias are present, as in the case of a BGA footprint. Employing a divide-and-conquer approach allows for the modeling of these geometries separately, i.e., 3-D full wave solvers for the sections with holes and vias, and a cavity model approach, for the simple parallel-plate structures. Also, equivalent circuit models can be obtained for time-domain and frequency-domain SPICE simulations"--Abstract, page iv.
Drewniak, James L.
DuBroff, Richard E.
Electrical and Computer Engineering
Ph. D. in Electrical Engineering
University of Missouri--Rolla
Journal article titles appearing in thesis/dissertation
- Modeling of BGA footprints for power integrity on multilayer printed circuit boards from first principle and circuit model extraction
- Physics-based via models with the parallel-plate impedance included: coupled vias, full-ground vias and half-ground vias
- Physics-based via models with the parallel-plate impedance included: including the stripline to via discontinuity
- Physics-based via models with the parallel-plate impedance included: single-ended via models
xvi, 116 pages
© 2007 Giuseppe Selli, All rights reserved.
Dissertation - Open Access
Library of Congress Subject Headings
Ball grid array technology
Electric power distribution
Electronic apparatus and appliances -- Power supply
Signal processing -- Quality control
Print OCLC #
Electronic OCLC #
Link to Catalog Recordhttp://laurel.lso.missouri.edu/record=b6399017~S5
Selli, Giuseppe, "BGA footprints modeling and physics based via models validation for power and signal integrity applications" (2007). Doctoral Dissertations. 2002.