"A novel process utilizing an organic immersion plating bath (OIPB) was developed for depositing gold films onto nickel films by a galvanic displacement reaction. The bath was prepared with poor electrically conductive organic solutions that are commonly used for the liquid-liquid extraction of metal ions from aqueous solutions.
The objectives of the study were to identify bath parameters that would result in the deposition of uniform, continuous gold films. The parameters investigated included: gold concentration (0.1 to 3.0 g/L); amount of metal extractant (1.7 to 50 vol. %); type of metal extractant; type of diluent; deposition time (0.5 to 30 minutes); and deposition temperature (20 to 40⁰C). The effect various additives (HCl, H2SO4, KCl, water, glacial acetic acid, acetone, decanol, methanol) and sparging gases (N2, 5%H2/Ar forming gas, compressed air) had on the morphology of the deposited gold films was also considered.
It was found that the type of metal extractant and diluent had a substantial effect on the morphology of the deposited gold film; an addition of HCl to the OIPB was required to obtain gold films composed of uniform gold particles. The deposition rate was self-limiting which is characteristic of galvanic displacement reaction. First-order reaction rate constants were determined; the reaction rate was found to be mixed chemical/diffusion controlled.
Characterization of the deposited gold films demonstrated that they were crystalline and composed of nanometer sized particles. Furthermore, it was found that the gold films were typically 18-35 nm thick and composed of pure metallic gold with no co-deposited nickel or carbon detected in the gold film"--Abstract, page iv.
Miller, F. Scott, 1956-
O'Keefe, T. J. (Thomas J.)
Ramsay, Christopher W.
Schuman, Thomas P.
Materials Science and Engineering
Ph. D. in Materials Science and Engineering
United States. Department of Education. Graduate Assistance in Areas of National Need
University of Missouri--Rolla
Journal article titles appearing in thesis/dissertation
- Spontaneous electrochemical deposition of gold coatings from organic solutions
- Development of an organic solution immersion gold plating bath
- Kinetic aspects of depositing gold from an organic immersion plating bath
- Parameters affecting the deposition of gold from an organic immersion plating bath onto sputtered nickel films
xxi, 149 pages
© 2003 Eric James Dahlgren, All rights reserved.
Dissertation - Restricted Access
Library of Congress Subject Headings
Print OCLC #
Electronic OCLC #
Link to Catalog RecordElectronic access to the full-text of this document is restricted to Missouri S&T users. Otherwise, request this publication directly from Missouri S&T Library or contact your local library.http://laurel.lso.missouri.edu:80/record=b5016145~S5
Dahlgren, Eric James, "Deposition of gold from an organic immersion plating bath for microelectronic applications" (2003). Doctoral Dissertations. 16.