Title

Hard Mask for Low-k Interlayer Dielectric Patterning

Abstract

Described herein are embodiments of a hard mask including a surface to reduce adhesion to an anti-reflective material deposited on a surface, wherein the surface to reduced adhesion provides use of a process to remove the anti-reflective material deposited on the surface that minimizes damage to an interlayer dielectric layer below the hard mask and methods of manufacturing the same.

Department(s)

Civil, Architectural and Environmental Engineering

Patent Application Number

11/540,528

Patent Number

US 7,649,264

Document Type

Patent

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2010 Intel Corporation, All rights reserved.

Share

 
COinS