Control of CuO Particle Size on SiO₂ by Spin Coating
Atomic force microscopy (AFM) and X-ray photoelectron spectroscopy (XPS) were used to study the size and distribution of nanometer-sized metallic particles of four Cu/SiO2 model catalyst systems. The systems were constructed by spin coating copper(II) acetate [Cu(CH3CO2)2·H2O, Cu(ac)2] solutions of varying concentration (0.0040, 0.0070, 0.0085, and 0.010 M) onto polished Si(100) substrates with an 5-10 nm SiO2 oxide overlayer. Homogeneously distributed, nanometer-sized CuO particles were formed by calcinating the samples to 450 °C for 4 h. Narrow particle size distributions were observed for each system, with mean particle size increasing with increasing concentration. The ability to control mean particle size to the order of 1 nm was successfully demonstrated over this concentration range.
M. A. Brookshier et al., "Control of CuO Particle Size on SiO₂ by Spin Coating," Langmuir, American Chemical Society (ACS), Jan 1999.
The definitive version is available at https://doi.org/10.1021/la981325k
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