The Adhesion of Thin Plasma-polymerized Organic Films to Metal Substrates
The direct pull method was used to study the adhesion of thin (<1 μm) plasma-polymerized films on metal substrates. Application of this method provides information on the cohesive, as well as the adhesive, properties of these films. After breakage of the films by the pull method, the interface was analyzed by scanning electron microscopy to determine the nature of the breakage at the interface. Electron spectroscopy for chemical analysis was used to determine whether any chemically adsorbed layers of organic films remained after the films had been pulled from the metal substrate. The adhesive or cohesive strengths of plasma-polymerized tetrafluoroethylene and chlorotrifluoroethylene films on 304 stainless steel, aluminum and silver were measured by the pull method. Adhesive strength was found to be higher than cohesive strength for plasma-polymerized tetrafluoroethylene films on the various substrates. The result for plasma-polymerized chlorotrifluoroethylene films was not as expected, indicating that considerable care is required in the interpretation of tensile tests of laminates such as those conducted in this study. © 1977.
K. Bhasin et al., "The Adhesion of Thin Plasma-polymerized Organic Films to Metal Substrates," Thin Solid Films, Elsevier, Jan 1977.
The definitive version is available at http://dx.doi.org/10.1016/0040-6090(77)90225-5
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© 1977 Elsevier, All rights reserved.