Title

Deep-ultraviolet Antireflective Coating with Improved Conformality, Optical Density, and Etch Rate

Abstract

A new bottom antireflective coating (BARC) for 248 nm lithography is described. The new coating has an optical density of approximately 10/micrometers (k equals 0.41 and n equals 1.482) and plasma etches at rates higher than that of DUV resists depending on the etch conditions. Coating conformality is superior to older generation BARCs, also contributing to improved etch dynamics. Excellent 0.25 micrometers features have been obtained with ESCAP, Acetal and t-BOC type photoresists. The new BARC is spin coated from safe solvents and is spin bowl compatible with EBR and photoresist solvents. ©2003 Copyright SPIE - The International Society for Optical Engineering.

Meeting Name

Proceedings of SPIE - The International Society for Optical Engineering (1998, Santa Clara, CA)

Department(s)

Chemistry

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 1998 SPIE -- The International Society for Optical Engineering, All rights reserved.


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